Performance:
The coating layer of anode is firm and stable, with high corrosion resistance and long service life
Effectively reduce the voltage, and the energy-saving effect is obvious
Ultra-low electroplating additive consumption, reduce production cost
The u-current density is evenly distributed and has higher through-hole /via filling yield
Scope of application:
VCP/Horizontal line copper plating
Through hole/via filling/pulse copper plating for Flex PCB & PCB
Semiconductor substrate electroplating
Scenarios for application:
?你们的产品多少吨起订?需求量少怎么办?
您好,每种规格8吨起订;需求量少,可拨打客服热线:0755-23426892,让客服协助您进行现货查询。
?你们是工厂还是经销商?
您好,我们是大型生产厂家,上市企业。用户遍布全球,三星、海尔、日立等都是我们的长期合作伙伴,可放心采购。
?你们的报价是固定的么?
您好,我们的报价由两部分组成,发货当天收盘均价+加工费,由于铝锭价每日都有波动,所以报价会有浮动。